梁永照论文题目：硅微通道阵列通透结构释放与整形技术研究

研究内容

1. 硅微通道阵列背部减薄及实验研究；

2. 硅微通道阵列通道保护技术研究；

3. 通道整形原理与实验研究；

4. 硅微通道阵列双面抛光工艺问题研究。

参考文献

[1] B W Cleaning. Wet-Chemical Etching and Cleaning of Silicon. High Temperature, 2003, 22401(January)
[2] G Yan, P C H Chan and I Hsing. An improved TMAH Si-etching solution without attacking exposed aluminum. Sensors and Actuators A: Physical, 2001, 89(1-2):135-141.
[3] T Trifonov, M Garin, A Rodriguez, P Ortega, L F Marsal and R Alcubilla. Post-etching shaping of macroporous silicon. in Proceedings of SPIE, 2007, 6593:65931Q.
[4] T Trifonov, A Rodriguez, L F Marsal, J Pallares and R Alcubilla. Two-and three-dimensional microstructures produced by electrochemical etching of silicon. 2005, 233-236.
[5] 雅菁, 刘志锋, 周彩楼, 辛颖 and 赵丹. 陶瓷注射成型的关键技术及其研究现状. 材料导报, 2007, 21(1):63-67.
[6] 汪重露. 陶瓷注射成型石蜡基粘结剂热脱脂行为研究 (MsD). 武汉理工大学, 2007.
[7] V N Phan, P Joseph, L Djeghlaf, A E D Allouch, D Bourrier, P Abgrall, A M Gue, C Yang and N T Nguyen. Capillary Filling in Nanochannels—Modeling, Fabrication, and Experiments. Heat Transfer Engineering, 2011, 32(7-8):624-635.
[8] H Kusumaatmaja, C Pooley, S Girardo, D Pisignano and J Yeomans. Capillary filling in patterned channels. Physical Review E, 2008, 77(6):067301.